A composition for film formation capable of forming a coating film excellent in low dielectric constant characteristics, cracking resistance, modulus of elasticity, and adhesion to substrates and useful as an interlayer insulating film material in semiconductor devices, etc. The system and method employ minimally obtrusive techniques to avoid interference with or damage to the target network during or after testing. Asset type need data is obtained from a demand database and at least one of the non-utilized assets is identified for recovery based on the obtained asset type need data.