An imaging system may include an image sensor package with an image sensor wafer mounted on a carrier wafer, which may be a silicon substrate. The drive socket also includes three flat surfaces, each flat surface being located opposite one of the lobes and equidistant from the center of the fastener. The PFET device can be a semiconductor-on-insulator thin film transistor construction, and can be formed over a conventional substrate or a non-conventional substrate. A second mask layer is applied to the first mask layer and to the uncovered side flank sections of the raised structure. The brim units can have a different size, shape, width, andor height than an adjacent brim unit.