A semiconductor assembly comprises a semiconductor package comprising a substrate, a die positioned on the substrate, and a lid positioned on the die. The upper surface bears a conductive pattern including a resonant ring and a number of open-circuit radiating elements each having an electrical length of a quarterwave at the resonant frequency of the ring. The lower end of the base of the article may be closed and may also contain a gusset. An upper and lower motor respectively connect the knuckle to the upper pole and the lower pole.