A semiconductor device with reinforced under-support structure and a method for fabricating the semiconductor device are provided, which can be used in the packaging of an MPBGATFBGA module to help reinforce the TFBGA under-support structure therein. The sole assembly includes a first portion and a second portion that are separated by a groove. With this structure, the speed of operation is increased at the time of data storage for a data signal input, and the number of MOS transistors is reduced. The second electronic switch is connected to the fifth and sixth switches. Users may be permitted to assign access rights to the uploaded files. Accordingly, the user can selectively retrieve and play back supplemental content associated with a primary broadcast channel.