An inspection and sorting system for part repair includes at least one sensor for inspecting a part. Some embodiments of the invention provide a two-layered data structure to store multidimensional data tuples that are defined in a multidimensional data space. The generator is configured to generate a second value by summing the first values. In second through fourth modes of the invention, during the SRNC relocation procedure the signaling links uplink and downlink transport channel IDs with the radio access bearer identifier. In this case, the ground lines are electrically connected with the shield layers, respectively, through metal bumps on both sides thereof. There is also a process for producing a semiconductor wafer with a front surface and a back surface and an epitaxial layer of semiconducting material deposited on the front surface.