The invention relates to a metallic sensor housing for an optoelectronic sensor which is composed of a plurality of parts. The shaft is rotationally inserted through the handle. Additionally, the programming instructions are operable to adjust one or more power consumption settings of an environment based on at least one of the receiving of the indication of the geoboundary event and the determination of the occurrence of the at least one of the RFID event and the LAN event. Moreover, the solder bump may be reflowed on the solder wettable pad so that the solder structure extends laterally from the solder wettable pad beyond the edge of the die after separating the die from the wafer. The monolithic component is made in a substrate divided into wells separated by isolating walls, the smaller surfaces of which are coated with insulating layers, the smaller surface of the substrate being uniformly coated with a metallization.