A chip-stacked semiconductor package and a method for fabricating the same are proposed. Moreover, the invention relates to a method for curatively or preventively controlling the phytopathogenic fungi of plants or crops, to the use of a combination according to the invention for the treatment of seed, to a method for protecting a seed and not at least to the treated seed. The aluminum-based metal is then dissolved using a solution that will not affect the alumina or the underlying substrate. The second high-side signal detection circuit resets the logical voltage state of the second voltage level via a second capacitor.