A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. The device may be placed within a fixed catalyst bed to partition the bed into a first top bed and a second virtual bed. The bending is accomplished by applying a force on a block including an inclined pressure plane that is abutted on the projection for plastically deforming the work piece, in which in bending the work piece, the direction of a first force applied on the work piece intersects with the direction of a second force of the inclined pressure plane pushing the projection. The leg assembly is equipped with a first flat to cooperatively engage the vehicle floor when the leg is in a first pivoted position and a second flat to cooperatively engage the vehicle floor in a second pivoted position. A tray set includes a tray insert and a base tray or support. Spacers, such as localized bumps, are formed on the strip to space strip layers apart to form uniform gaps.