The present invention includes an overplated component which includes an enlarged mushroom head having outer portions which overhang a hard baked resist layer. Further processing of the communication session occurs when a portion of the communication session meets a criterion and the communication session is permitted to continue when the portion of the communication session does not meet the criterion. An insulating resin is then formed on the release material so as to cover the semiconductor element; and a via, a wiring layer, an insulation layer, an external terminal, and a solder resist are then formed.