An exemplary image sensor package includes a base, an image sensor chip, a bonding layer, and an imaging lens. A plurality of wires respectively connected to the plurality of bonding pads of the first semiconductor chip are led out to the outside over a peripheral edge of the first semiconductor chip by passing through a space between the first and second semiconductor chips. Every fresh write access to a volume in a new snapshot lifetime is allocated a new section in the disk, called a provision, which is labeled with the sequence number. The result of the matching operation is a numerical score for each item of sponsored content that can be used to select sponsored content. An electric synchronization signal between the control drives maintains the difference between the phase angles electric actuators. The invention also relates to soybean cultivar S32-M2 further comprising one or more single gene traits, and to methods of producing a soybean having such traits by transformation or mutagenesis.