An expandable platform for deploying sensors in a medium includes a housing and a structural member disposed inside the housing. The system includes generating a second type of visualization of the first parameter in response to the presenting of the first type of visualization of the first parameter and presenting the second type of visualization of the first parameter. Thus, the efficiency of heat exchange is enhanced and the protracted continuous operation is realized. A method for manufacturing the interconnect is also provided. The method includes thinning the fourth region of the second face which corresponds to the scribe line formed in the second region of the first face, and cutting the semiconductor substrate along the scribe line formed in the second region of the first face. At least one layer includes a plurality of apertures and at least one other layer does not include the plurality of apertures.