A system includes a durable portion with a durable housing and a separable disposable portion with a disposable housing that selectively engage with and disengage from each other. The mechanism includes a bale support which is positioned below the bale when it is ejected, that catches and supports the bale. The cooled photolithographic substrate is subjected to a plasma process before the temperature of the cooled photolithographic substrate reaches the initial temperature. Each of the trench capacitors has a TTO that extrudes from a main surface of the semiconductor substrate. An improved seal is provided between the tarpaulin and container.