A flexible drive carrier is disclosed. The inventive structure provides a good flow path for working fluid while maintaining durability and structural stability independent of the structure associated with the wick material. The user requests are captured at the data centers. As the base sheet passes through the heated embossing nip, sufficient heat and pressure is imparted to cause the fibers within the sheet to begin to melt or glassinate. This data may be verified by means of simulation, lab testing, or application to a full-size well. Also provided is a method to form such a semiconductor structure using self-assembling block copolymer that can be placed at a specific location using a pre-fabricated hard mask pattern.