A method and apparatus for scaling is provided. A touch panel which includes a glass substrate coated with a resistive layer on one surface thereof; a pattern of edge electrodes on the resistive layer; a wire trace pattern on the resistive layer; a trench in the resistive layer between the wire trace pattern and the edge electrode pattern; and a protective insulative border layer over the edge electrode pattern and the wire traces. The position of the image sensor is initially fixed relative to the beamsplitter by the first fixative agent. The second tubular member and the overlapping portion of the first tubular member are then radially expanded again. Methods of using the guided filter system to direct and exchange endovascular devices to a region of interest, and to entrap and remove embolic material from the vessel are also disclosed. The IC diesubstrate assembly further includes at least one coupling that facilitates maintaining an IC diesubstrate gap definition between the IC die and the substrate.