A semiconductor device includes a laminate, a first semiconductor chip at least partly embedded in the laminate, a second semiconductor chip mounted on a first main surface of the laminate, and a first electrical contact arranged on the first main surface of the laminate. The assembly includes a support frame, a hook pivot base of cloven construction projecting outwardly away from the support frame and a support hook adapted to pivotally engage the hook pivot base. A second environmental value is measured at a second sensor and the trusted third party.