A method of forming a multi-layer semiconductor structure includes providing a first layer of a patterned copper bond film having a first predetermined thickness onto a first surface of a first semiconductor. A nonmagnetic layer is formed adjacent the flux shaping layer and positioned on an air bearing surface side of the flux shaping layer. The oscillating voltage is amplified to a high-level AC voltage through the secondary coil. To encourage the scarf to lie in multiple folds on the chest, the tube has a taller front end than rear end. The plurality of security rules each specify at least one action to be taken in response to a given condition, which is based, at least in part, on a corresponding given one of the message sections.