A wired circuit board is provided having a reinforced part thickened to ensure a high rigidity when it is used, while having the reinforced part thinned for easy handling when it is not yet used to prevent a cost increase and a productivity reduction. A cohesive material is applied to surface portions of the packaging material so that when wrapped around an article cohesive portions stick together and seal the package. This simultaneously achieves a reduced thickness and improved thermal resistance of the electrode film and a reduced change in piezoelectricelectrostrictive properties with time, thereby producing a piezoelectricelectrostrictive element with good initial piezoelectricelectrostrictive properties and with a small change in the piezoelectricelectrostrictive properties with time. Efficient formation is facilitated by collecting the marginal portions of the web of material, and at least partially recycling the collected portions for formation of the wide web. The LMHE dielectric can have a Young’s modulus of less than 50,000 psi and an ultimate elongation property of at least twenty percent.