A sled carriage is configured to move in a direction of an axis and a track is attached with the sled carriage. Firstly, a MALDI matrix is dusted on to the sample followed by a spray of a suitable solvent onto the dusted sample. The melting temperature of the inner layer is greater than or equal to the melting temperature of the outer layer. The method involves stretching the water soluble dry film over a surface of the semiconductor wafer, and attaching the moistened inner area of the stretched film to the surface of the semiconductor wafer. The first end region of each link member is disposed on a lateral side of the frame member and closely to the upper surface of the support plate.