There is provided a sliding part in which a surface coverage ratio of copper in the sliding part increases. In accordance with embodiments of the invention, a semiconductor structure comprises a III-P light emitting layer disposed between an n-type region and a p-type region. The formation of the actual subpixel extraction is carried out according to multiplex schemes predetermined according to an observer actual position. A cylinder is provided, and the bearing assembly rotatably supports the cylinder on the support shaft. This heat generator is crossed in one direction by the heat transfer fluid entering the magnetocaloric element through one of the ends during a heating or cooling cycle and to be crossed in the opposite direction by the heat transfer fluid exiting the magnetocaloric element through the same end during the other cooling or heating cycle.