The present invention relates generally to the reclaiming of carpet waste material. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot. The locking buckle has a main body portion and a release mechanism. ; and subjecting the semiconductor substrate to a second annealing step in NH3 gas, at pressure exceeding 5 torr. A considerably more compact and shorter growth habit than the \u2018Moonshine\u2019 variety also is displayed.