Gaming devices and methods of operating gaming devices are provided that include indicator or designator symbols. The method comprises calculating an estimated amount of damage that an element of the device would suffer if the device were operated under a set of specified conditions over a certain period of time. During the application of plasma between the bonding surfaces, a bonding devices direct contact fusiondiffusion bonds the metal bonding edges of the package to the metal bonding surface surrounding the circuitry to be enclosed.