A method and an apparatus for performing trench depth analysis in semiconductor device manufacturing. The permeable zones may be sealed by passing the plugging composition and water to the subterranean formation. The apparatus includes a determining part configured to determine whether the document includes a low line-screen ruling area. A connection tool uses the tags to match up the connection points of the parent block to the respective connection points in the child block to allow a simulation tool to include the clock signal timing data of the child block in simulating the clock performance of the parent block. A contact hole spacer covers side wall of the contact hole. The identified first route has an edge that is at least partially diagonal.