A method for forming a porous insulative structure on a semiconductor device structure includes forming a layer of unconsolidated electrically insulative, or dielectric, material with microcapsules dispersed therethrough on at least a portion of the surface of the semiconductor device structure. The transparent adhesive layer has an outer surface facing the optical film. The flexible sheet is unfolded and extended downwards to the connecting portion and comprises of an inner surface, an outer surface, an extended end and a folded flange. Depending upon the monitored value of the sensor, the control system will modify the power that supplies a control mechanism that is used to control an operational parameter of the harvester, such as the groundspeed.