A wafer-level chip scale package is disclosed, including a chip including a substrate and a GaN transistor disposed on the substrate. Specifically, a network device such as an Access Point or Foreign Agent supports multiple VLANs on a plurality of interfaces. The oscillation unit is adapted to output an oscillation signal having an oscillation frequency that varies according to a control code. Frictional forces from the advancing outer tube are applied to the component within the outer tube and, in turn, are applied to the inner tube thereby advancing the inner tube at a rate substantially the same as the outer tube.