A photoresist resin composition comprises about 10 to about 35% by weight of an acryl-based copolymer, about 5 to about 10% by weight of a quinone diazide compound, about 55 to about 80% by weight of a solvent, and about 0. 1 to 2 \u03bcm, which are filled in an aerosolization chamber, are shakenagitated together with carrier gas in a high-pressure gas cylinder which stores the carrier gas, thereby being aerosolized. An associated method is disclosed.