Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. An ink chamber plate is connected to the substrate to define with the partition walls an ink chamber for supplying ink to the channels. The lid lock is used to lock the lid in the closed position. At least one driver is provided to drive the FETs. As a result, a write precompensation amount is corrected according to the characteristics of the normal current and the irregular current, and a write precompensation amount is determined, so that the write precompensation amount with higher accuracy than that with a conventional technique can be determined.