A semiconductor die having multiple solder bumps, each having a diameter less than about 100 microns, and the method for making such a die are described. The below described relation is established, wherein AV is a difference in voltage on the photoconductive member creating an imperceptible difference in density on an output image, d is a rate of a voltage discharged on the photoconductive member in relation to an interval of the gap I between the discharge member and the image bearer:\u0394V\u2267I\xb7d. Such data can then be compared with best practice rules to identify potential enhancements to efficiency or scalability of such components. The base station utilizing the time resource and the frequency resource sends the MBMS service information to the terminal via MBMS point to MCCH. The organic EL display device can improve production yield and restrain visual failure from being caused with the lapse of time by including a protection layer 109 so as to prevent the inorganic solid layer 104 from being damaged.