A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. Each successive turn has the same width substantially corresponding to a constant width of each slot, wherein a first turn has a first thickness and a second turn has a second thickness thicker than said first thickness. Further, the computer system includes a fabric and at least one processor agent coupled at least indirectly to the first core and the first memory segment, and also coupled to the fabric.