The various technologies presented herein relate to a three dimensional manufacturing technique for application with semiconductor technologies. Control electronics, adapted to control a predetermined function with respect to the BOP stack, are disposed within the housing and connected to one or more controllable devices by a wet mateable connector interface. The radiant energy source is adapted to emit radiant energy onto the inner surface of the belt at the nip. The programming and testing operations are performed by the same piece of equipment that performs the PCBA assembly operation. Also, the configuration of the barbs may be a certain spirality angle \u03b1, barb cut angle \u0398, barb cut depth, barb cut length, barb cut distance, corrugated barb underside, arcuate barb base, or varying barb size.