Methods, systems, and apparatuses are disclosed for laser peening hidden surfaces. A first semiconductor chip is stacked in a region, on a second semiconductor chip, in which a circuit that generates noise is not disposed within said second semiconductor chip, and a wire of a circuit that easily receives noise within said first semiconductor chip is disposed so as not to extend over said circuit that generates noise. When the whole leading vehicle enters the tunnel, the intake control valve 8 closes, and air is discharged through the outlet 11 via a pump 10. A focus mechanism may automatically set the 2D focus distance and the 3D focus distance to be essentially equal by one of adjusting the first lens based on the 3D focus distance and synchronously adjusting the left and right lenses based on the 2D focus distance.