A trench is etched in a semiconductor wafer by turning a first introduced gas introduced into a reaction chamber into plasma. The temporary clamping structure for electronics is arranged such that the fitting pawl is unfixed from the fitting hole by bending the tip end of second protrusion of the electronic device body in the direction in which the second protrusion goes away from the first protrusion. On or in the heating foil, between the one or the several lighting means and the one or the additional power supply points, are configured or integrated conductive tracks providing current which contact said power supply points. The time to digital converter includes a D flip-flop for sampling first and second input clocks with a third clock, and a counter configured to synchronously increment the resulting samples and create a digital proportional value representing the delay between the first and second clocks. Additionally, processes to make and use same are provided.