An EEG electrode system for establishing positive electrical contact with the scalp, uses absorptive electrode wrap material in contact with metallic electrodes, with saturated electrode wrap material placed in contact with the scalp. The integrated circuit package may have a substrate, an integrated circuit chip die supported by the substrate. Each spacecraft has a launch vehicle adapter structure providing a respectively coplanar structural interface directly with the single launch vehicle payload adapter. The condensing duct has an ultrasonic atomizing unit, a condensing unit and a water adsorption unit therein, while the blower duct has a blower fan and a heater therein.