1459943110-e77e6fb8-aa32-498f-85b8-5deca844fe3c

An semiconductor device comprising a first semiconductor die and a leadframe. Next, in a second step, etching with the gate electrode as a mask is conducted so as to dig down a surface layer of the silicon substrate. The lower portion of each post has embedded therein an alarm contact. A second baffle is located to direct cooling air over a back of the remote radio head.