An edge seal around the periphery of an integrated circuit device which environmentally protects the copper circuitry from cracks that may form in the low-k interlevel dielectric during dicing. Further disclosed are a heat transfer surface and a heat transfer element utilizing the heat transfer medium. Network diagrams may be presented with items of interest in sharp definition and the remainder of a diagram or diagrams being blurred or having relative degrees of sharpnessblurriness. A selection of disposable cartridges and a method for manipulating samples in liquid droplets that adhere to a hydrophobic surface can be used with the system.