Patterns of sensor elements that can be used in capacitance sensing devices are described. More specifically, the exemplary embodiments of the disclosed optical transceiverstransponders relate to a 43 Gbs 300pin MSA and a 43\u02dc56 Gbs CFP MSA module, both include a two-carrier optical transceiver and the appropriate hardware architecture and MSA standard interfaces. Additional embodiments involve depositing multiple layers of conductive material within the opening and above the insulating layer, where one of the conductive layers includes aluminum and is deposited using a \u201ccold aluminum\u201d process, and a second one of the conductive layers also includes aluminum, but is deposited using a \u201chot aluminum\u201d process.