A heat dissipation device comprises a multilayer substrate, a channel formed in the multilayer substrate, and tubes disposed within the channel, the tubes suitable for removing heat from a heat generating device located adjacent to the multilayer substrate. The chassis defining rear and side openings for cable entry and exit. The channelized circuit data is formatted into one or more ATM cells. In use, flame is supplied to the flame filter, and inhalation causes ambient air to enter the flame filter as well. The destination hypervisor passes the network message to the destination virtual machine identified by the unique identifier. The stud bumps are formed in an array and each has a flattened top to electrically connect to a printed circuit board, PCB, by an anisotropic conductive paste to achieve a thin package and to avoid substrate warpage problems of a ball grid array during high-temperature reflow processes.