A wafer bonding method of forming silicon-on-insulator comprising integrated circuitry includes nitridizing at least a portion of an outer surface of silicon of a device wafer. The lens module includes a flash lamp lens and a holder integrally formedmolded with the lens. Depending on the multicast application requirement, when a routing loop is detected during the repairing of a multicast distribution tree, the severed node may abort, or the repair can be deferred until the connection to the root-node is re-established. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material. The adjustments provide an adaptive neurostimulation therapy that supports or enhances therapeutic efficacy based on the information.