Stiffeners for tapes, films, or other connective structures, which are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated bonding processes, are fabricated by stereolithographic processes and may include one or two or more layers. The external device is programmed to interact with other similarly-enabled devices. If the visibility attribute is set to a global value, the contact information record may be viewed by all folders.