An illuminated instrument cluster utilizes a single light emitting diode to backlight the entire dial surface. The package structure has at least a lead frame, a die, a plurality of conductive wires and an encapsulating plastic body. A temperature sensor is adapted to sense the temperature of the electronic components during the flight of the vehicle. In one embodiment, the phased-locked loop circuit is configured to lock on a first signal in less than or equal to about 1 microseconds.