A semiconductor device includes a semiconductor element, a light-blocking region enclosing the semiconductor element, a plurality of contacts disposed in a staggered arrangement in a first region of the light-blocking region, and a linear contact formed to extend along at least a first direction in a second region of the light-blocking region differing from the first region. At shallow depths, a formation with abnormally high fluid pressure has a shear velocity that is close to zero, and is thus significantly different from the shear velocity of overlying sediments. A plurality of channels and deflectors are spaced apart within each liquid collection region and vapor passages are formed in the spacings between adjacent channels. The network relocates most of the bond pads dedicated to power supply from the conventional alignment along the chip periphery onto the newly created bondable lines, saving substantial additional amounts of silicon real estate, and freeing the bonding machines from their extremely tight connector placement and attachment rules to much more relaxed bonding programs. The support tube is laser welded to the clip.