A method including forming a via dielectric layer on a semiconductor device substrate; forming a trench dielectric layer on the via dielectric layer; forming a trench through the trench dielectric layer to expose the via dielectric layer; forming a via in the via dielectric layer through the trench to expose the substrate; and forming a semiconductor material in the via and in the trench. The magnetic head includes a recording head and a reading head. The power supply unit is installed at the rear side of the positioning frame base for converting and supplying steady DC power for the LED bars. The collagenous tissue to be contacted with the crosslinking reagent is preferably a portion of an intervertebral disc or articular cartilage. Information about an operating state of the computer system, as well as an address space identifier, are used to determine whether, and under what circumstances, an attempted memory access is permissible. Upon curing of the resin, the bladder is deflated and the fluid drained or otherwise disposed of, with the cured resin sleeve or patch remaining in place lining the pipe.