The present invention is in the field of soybean cultivar 04KG128257 breeding and development. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. When formed into a paper sheet, the invented fibers form a highly porous paper having improved strength and reduced dusting. The clamp can mount the base to a mayo stand of a multi-purpose gurney.