A method for forming vias which pass through a semiconductor wafer substrate assembly such as a semiconductor die or wafer allows two different types of connections to be formed during a single formation process. In one embodiment, the different data rates are accomplished using different modulation techniques. The scanning apparatus also comprises a detector unit for detecting the excited radiation collected on the objective lens. The relative-dielectric-constant measuring apparatus can calculate the relative dielectric constant of the insulation film based on the measured film thickness, gap, and accumulation capacitance. The method includes wirelessly communicating traffic control information from a traffic control sign to a vehicle and wirelessly communicating vehicle information from the vehicle to the traffic control sign.