A bump chip carrier semiconductor package system is provided including providing a lead frame, forming circuit sockets in the lead frame, mounting a semiconductor die on the lead frame, wherein the semiconductor die have electrical interconnects that connects to the circuit sockets, and encapsulating a molding compound to cover the semiconductor die and the electrical interconnects. The modular system includes a base member and one or more crafts connected thereto. The closing lid has a lid body having a sealing surface contacting the connecting surface of the connecting flange, a supply pipe which supplies an inert gas to a space between the closing lid and the valve body in the housing, a supply valve which opens or closes the supply pipe, a discharge pipe which discharges a gas in the space, and a discharge valve which opens or closes the discharge pipe. Objects can be tagged by dropping a tag onto the object, or relating a database record for the tag to a database record for the object. Processed image data are then obtained by carrying out second AWB processing different from the first AWB processing on the inverse AWB image data, and a print is generated by output means based on the processed image data. The plurality of communication holes is arranged substantially along the rotative direction of the outer circumferential portion at nonuniform pitches.