An apparatus package for high-temperature thermal applications for ball grid array semiconductor devices and a method of packaging ball grid array semiconductor devices. An elongated base portion on the mounting bar is adapted to mount to the face of a conventional electrical box and extend beyond the walls of the box. As a result of the inventive ratio of these components, it is possible with much lower lightweight filler contents to obtain more cost effective mortar formulations andor improved use characteristics, such as e. Also described herein are methods for making and using the tissue grafts.