Disclosed are a system and method of detecting a diode fault among diodes coupled to a plurality of redundant power feeds. The method further includes applying at least one frontside common electrical contact to a frontside of the quantum well wafer, bonding a transparent substrate to the frontside of the quantum well wafer, thinning the bulk substrate layer of the quantum well wafer, and etching the quantum material layer to form quantum well facets that define at least one pyramidal quantum well stack. The sheathing member has one or more openings connecting the hollow space inside the sheathing member with the space outside of the sheathing member. The associated driver circuits may be arranged at the same border or at opposite borders of the matrix, so that an array of almost any desired length can be put together from the device without gaps in one dimension.