A semiconductor chip 2 is disposed within a device hole as formed in a tape base material 1a of a tape carrier 1, which chip is smaller in thickness than the tape base material 1a, and then sealing is performed by a seal resin 3 to permit both the principal surface and back surface of such semiconductor chip 2 to be coated therewith. The component comprises a sensor which is located such that at least part of the sensor is exposed to the wind. A document-based 3D translator may extract image data and other information from the input document and may translate the image into a map projected on a 3D model of the Earth’s surface, using embedded location andor extent information.