An electrical connector includes an insulative housing and a plurality of terminals received in the housing. The system may include at least one computer system including a touchscreen. Based on the motion data, a current location andor shape of a surrogate is determined and deviations between the current location andor shape and a reference location andor shape are determined. The signal code power measurements are summed and ranked, and interfering transmitters associated with the ranked signal code power measurements for the interfering sources are determined. The method and system calculates thickness, volume, density during the landfill operation to ensure that the landfill is comprised of compacted layers of substantially optimized density. According to the present invention, a second layer of solder structure is deposited on to each of the solder bump precursor structures formed by a first layer of solder structure to increase the solder-bump volume, which results in solder bumps with increased height.