A multi-chip device and method of stacking a plurality substantially identical chips to produce the device are provided. The monitoring component is for monitoring inputoutput activity for virtual storage logical units over time. The at least one carrier tube is configured to house a pusher and a suturing apparatus, the carrier tube having an expulsion end. The parallel hybrid diode has smaller operation resistance and as a result better ESD robustness. Each prong or spline is adjacent with at least two other prongs or splines.