An electrical connection system 200 comprises a rail 202 and a plurality of electrically conducting posts 204 fixed to the rail 202. The first semiconductor chip generates a plurality of counter codes by using an internal clock or an external input clock and transmits slave address signals and the counter codes through a through-chip via. The resultant binder provides minimal processing difficulties and a product which exhibits minimal water absorption. After the mold is opened, the cut-out portion of the compression area can be removed to expose the hole. The methods include methods of treating or preventing a disease ameliorated by modulation of premature translation termination or nonsense-mediated mRNA decay, or ameliorating one or more symptoms associated therewith.